| Bahan dasar | Papan PCB FR4 |
|---|---|
| Ketebalan papan | 0.8-4.0 ketebalan |
| Lapisan | 1-24 Lapisan |
| Topeng solder | Green. Hijau. Red. Merah. Blue. Biru. White. Put |
| Pengobatan permukaan | OSP, Immersion Gold, Immersion Tin |
| Bahan dasar | PCB FR4 dua sisi |
|---|---|
| Ketebalan papan | 1.6mm |
| Lapisan | 1-24 Lapisan |
| Sertifikat | UL/14001/ROHS/ISO9001 |
| Pengobatan permukaan | OSP, Perendaman Emas, Perendaman Timah |
| Bahan dasar | FR-4 1.6mm 1oz tembaga |
|---|---|
| Ketebalan papan | 1.6mm-5.0 |
| Lapisan | 1-24 Lapisan |
| Standar PCB | Standar IPC-II |
| Ukuran papan | Dapat Disesuaikan |
| Bahan dasar | Basis Aluminium |
|---|---|
| Ketebalan tembaga | 1 / 2oz |
| Dapat dikupas | 0,3-0,5 mm |
| Profiling Punching | Perutean, V-CUT, Beveling |
| Layanan | Layanan Satu Pintu |
| Bahan dasar | FR4 pcb |
|---|---|
| Ketebalan papan | 1.6mm |
| Lapisan | 1-24 lapisan |
| Standar PCB | Standar IPC-II |
| Ukuran papan | Dapat disesuaikan |
| Bahan dasar | Basis Aluminium |
|---|---|
| Ketebalan tembaga | 1 / 2oz |
| Dapat dikupas | 0,3-0,5 mm |
| Profiling Punching | Perutean, V-CUT, Beveling |
| Layanan | OEM ODM |
| Bahan dasar | Papan PCB FR4 |
|---|---|
| Ketebalan papan | 0.8-4.0 ketebalan |
| Lapisan | 1-24 Lapisan |
| Topeng solder | Green. Hijau. Red. Merah. Blue. Biru. White. Put |
| Pengobatan permukaan | OSP, Immersion Gold, Immersion Tin |
| Nama merek | Yizhuo |
|---|---|
| Bahan dasar | Basis Aluminium |
| Ketebalan tembaga | 1 / 2oz |
| Dapat dikupas | 0,3-0,5 mm |
| Profiling Punching | Perutean, V-CUT, Beveling |
| Nama merek | Yizhuo |
|---|---|
| Bahan dasar | Basis Aluminium |
| Ketebalan tembaga | 1 / 2oz |
| Dapat dikupas | 0,3-0,5 mm |
| Profiling Punching | Perutean, V-CUT, Beveling |
| Bahan dasar | Basis Aluminium |
|---|---|
| Ketebalan tembaga | 1 / 2oz |
| Dapat dikupas | 0,3-0,5 mm |
| Profiling Punching | Perutean, V-CUT, Beveling |
| Layanan | Layanan Satu Pintu |
