| Bahan dasar | Basis Aluminium |
|---|---|
| Ketebalan tembaga | 1 / 2oz |
| Dapat dikupas | 0,3-0,5 mm |
| Profiling Punching | Perutean, V-CUT, Beveling |
| Layanan | Layanan Satu Pintu |
| Bahan dasar | Papan PCB FR4 |
|---|---|
| Ketebalan papan | 0.8-4.0 ketebalan |
| Lapisan | 1-24 Lapisan |
| Topeng solder | Green. Hijau. Red. Merah. Blue. Biru. White. Put |
| Pengobatan permukaan | OSP, Immersion Gold, Immersion Tin |
| Nama Produk | Papan FR4 PCB |
|---|---|
| Bahan dasar | Basis Aluminium |
| Ketebalan tembaga | 1 / 2oz |
| Dapat dikupas | 0,3-0,5 mm |
| Profiling Punching | Perutean, V-CUT, Beveling |
| Nama merek | Yizhuo |
|---|---|
| Bahan | Tembaga Berat |
| Ketebalan tembaga | 1 / 2oz |
| Dapat dikupas | 0,3-0,5 mm |
| Profiling Punching | Perutean, V-CUT, Beveling |
| Nama merek | Yizhuo |
|---|---|
| Bahan dasar | Basis Aluminium |
| Ketebalan tembaga | 1 / 2oz |
| Dapat dikupas | 0,3-0,5 mm |
| Profiling Punching | Perutean, V-CUT, Beveling |
| Standar | IPC-Kelas2/Kelas 3 |
|---|---|
| Ketebalan tembaga | 1 OZ |
| Lebar garis min | 0.25mm |
| Ketebalan papan | 1.0/1.2/1.6mm |
| Finishing permukaan | HASL, OSP, ENIG, Jari emas |
| Bahan dasar | Basis Aluminium |
|---|---|
| Ketebalan tembaga | 1 / 2oz |
| Dapat dikupas | 0,3-0,5 mm |
| Profiling Punching | Perutean, V-CUT, Beveling |
| Layanan | Layanan Satu Pintu |
| Standar | IPC-Kelas2/Kelas 3 |
|---|---|
| Bahan | Basis Aluminium |
| Lebar garis min | Lebar garis min |
| Ketebalan papan | 1.0/1.2/1.6mm |
| Finishing permukaan | HASL, OSP, ENIG, Jari emas |
| Lapisan | 1-2 lapisan |
|---|---|
| Ketebalan tembaga | 1 OZ |
| Lebar garis min | 0,075mm (3/3 juta) |
| Ketebalan papan | 1.0/1.2/1.6mm |
| Finishing permukaan | HASL, OSP, ENIG, Jari emas |
| Nama merek | Yizhuo |
|---|---|
| Bahan dasar | Basis Aluminium |
| Ketebalan tembaga | 1 / 2oz |
| Dapat dikupas | 0,3-0,5 mm |
| Profiling Punching | Perutean, V-CUT, Beveling |
